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   5.1. References to Tabular Data:

1. Authors not listed; "Lead-Free Alloy Trends for the Assembly of Mixed Technology PWBs", Proc. NEPCON-West 2000 (Feb. 27-Mar. 2) Anaheim, CA
2. M. Abtew, "Wetting Characteristics of Lead Free Solders for High Volume Surface Mount Application," Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar. 2, 2000) Anaheim, CA
3. Chad M. Miller, Iver E. Anderson and Jack F. Smith, "A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu," J. Electronic Mater. 23(7) 595-601 (1994)
4. Iver E. Anderson, "Tin-Silver-Copper: A Lead-Free Solder for Capacitor Interconnects," p. 16, Proc. 16^th Capacitor and Resistor Technology Symposium (CARTS 96), 11-15 March, 1996
5. Iver E. Anderson, Özer Ünal, Tamara E. Bloomer and James C. Foley, "Effects of Transition Metal Alloying on Microstructural Stability and Mechanical Properties of Tin-Silver-Copper Solder Alloys," Proc. Third Pacific Rim International Conference on Advanced Materials and Processing (PRICM 3) (The Minerals, Metals and Materials Society, 1998)
6. Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C. Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Electronic Assemblies," IPCWorks ’99: An International Summit on Lead-Free Electronics Assemblies," (October 25-28, 1999), Minneapolis, MN
7. Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C. Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Joining Applications," p. 575 (complete citation not available)
8. Artaki, D.W. Finley, A.M. Jackson, U. Ray and P.T. Vianco, "Wave Soldering with Pb-Free Solders," Proc. Surface Mount International (San Jose, CA, August 27-31, 1995), p. 495.
9. Peter Biocca, "Global Update on Lead-free Solders," Proc. Surface Mount International (San Jose, CA, 1998), pp. 705-709
10. E.A. Brandes, Smithells Metals Reference Book, 6^th ed. (Butterworths, London, 1983)
11. S.D. Brandi, S. Liu, J.E. Indacochea and R. Xu, "Brazeability and Solderability of Engineering Materials," ASM Handbook, Vol. 6: Welding, Brazing and Soldering (ASM International, 1993)
12. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, eds., The Mechanics of Solder Alloy Interconnects, p. 60 (Van Nostrand Reinhold, New York, 1994)
13. E.Gebhardt and G. Petzow, Z. Metallkde. 50, 597 (1950)
14. Judith Glazer, "Microstructure and Mechanical Properties of Pb-free Solder Alloys for Low-Cost Electronic Assembly: A Review," J. Electronic Materials 23(8), 693 (1994)
15. D.E. Gray, ed., American Institute of Physics Handbook, (McGraw-Hill, New York, 1957)
16. Angela Grusd, "Lead Free Solders in Electronics," SMI97, p. 648
17. William B. Hampshire, "The Search for Lead-Free Solders," Proc. Surface Mount International Conference (Sept. 1992) San Jose, CA, p. 729
18. E.W. Hare and R.G. Stang, J. Electronic Mater. 21, 599 (1992)
19. Cynthia L. Hernandez, Paul T. Vianco, Jerome A. Rejent, "Effect of Interface Microstructure on the Mechanical Properties of Pb-Free Hybrid Microcircuit Solder Joints," IPC/SMTA Electronics Assembly Expo (1998), p. S19-2-1
20. J.S. Hwang, "Overview of Lead-Free Solders for Electronics & Microelectronics," Proc. SMI Conf. , p. 405
21. S.K. Kang, J. Horkans, P.C. Andricacos, R.A. Carruthers, J. Cotte, M. Datta, P. Gruber, J.M.E. Harper, K. Kwietniak, S. Sambucetti, L. Shi, G. Brouillette and D. Danovitch, "Pb-Free Solder Alloys for Flip Chip Applications," 49^th Electronic Components Technology Conf. (1999), June 1-4, San Diego CA
22. M.A. Korhonen, D.D. Brown and C.-Y. Li, "Mechanical Properties of Plated Copper," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 104 (MRS, 1994) ("plated [thin foil] copper")
23. M.A. Kwoka and D.M. Foster, "Lead Finish Comparison of Lead-Free Solders versus Eutectic Solder," Proc. Surface Mount International Conference (1994), p. 433
24. N.A. Lange, Handbook of Chemistry, p. 100 (Handbook Publishers, Sandusky, Ohio, 1956)
25. J. Lau, C. Chang, R. Lee, T.-Y. Chen, D. Cheng, T.J. Tseng, D. Lin, "Thermal-Fatigue Life of Solder Bumped Flip Chip on Micro Via-In-Pad (VIP) Low Cost Substrates"
26. J.H. Lau and S.-W. Ricky Lee, "Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies with Imperfect Underfills," Proceedings: NEPCON West Conference (February 28 – March 2, 1995), Anaheim, CA
27. N.-C. Lee, J.A. Slattery, J.R. Sovinsky, I. Artaki, P.T. Vianco, "A Drop-In Lead-Free Solder Replacement," Proceedings: NEPCON West Conference (February 28 – March 2, 1995), Anaheim, CA
28. N.-C. Lee and W. Casey, "Soldering Technology for Area Array Packages," Proceedings: NEPCON WEST 2000 (February 27 – March 2, 2000), Anaheim, CA
29. Ning-Cheng Lee, "Lead-Free Soldering of Chip-Scale Packages," Chip Scale Review, p. 42 (March/April 2000)
30. M.E. Loomans, S. Vaynman, G.Ghosh and M.E. Fine, "Investigation of Multi-component Lead-free Solders," J. Elect. Matls. 23(8), 741 (1994)
31. Rao Mahidhara, "A Primer on Lead-Free Solder," Chip Scale Review (March-April 2000)
32. T.B. Massalski, Binary Phase Diagrams, 2^nd ed. (Amer. Soc. Metals, 1990)
33. H. Mavoori, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer and Morris E. Fine, "Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders," Mat. Res. Soc. Symp. Proc. Vol. 390, p. 161 (MRS, 1995)
34. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine, "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," J. Electronic Materials, 26(7), 783 (1997)
35. Rodney J. McCabe and Morris E. Fine, "Athermal and Thermally Activated Plastic Flow in Low Melting Temperature Solders at Small Stresses," Scripta Materialia 39(2), 189 (1998)
36. Rodney J. McCabe and Morris E. Fine, "The Creep Properties of Precipitation-Strengthened Tin-Based Alloys," JOM, p. 33 (June 2000)
37. NCMS, Technical Reports for the Lead Free Solder Project: Properties Reports: "Room Temperature Tensile Properties of Lead-Free Solder Alloys;" Lead Free Solder Project CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998
38. Y.-H. Pao, S. Badgley, R. Govila and E. Jih, "An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)
39. Alan Rae and Ronald C. Lasky, "Economics and Implications of Moving to Lead-Free Assembly," Proc. NEPCON WEST 2000 (February 27 – March 2, 2000), Anaheim, CA
40. Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys," Proc. 50^th IEEE 2000 Electronic Components and Technology Conference (May 21-24, 2000), Las Vegas, NV
41. Jeff D. Sigelko and K.N. Subramanian, "Overview of lead-free solders," Adv. Mat. & Proc., pp. 47-48 (March 2000)
42. J.A. Slattery and C.E.T. White, U.S. Patent 5,256,370 (Oct. 26, 1993)
43. V. Solberg, "No-Lead Solder for CSP: The Impact of Higher Temperature SMT Assembly Processing," Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar. 2, 2000) Anaheim, CA (Source: Indium Corp.)
44. S.M. Spearing, M.A. Tenhover, D.B. Lukco, L. Viswanathan and D.K. Hollen, "Models for the Thermomechanical Behavior of Metal/Ceramic Laminates," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)
45. R.R. Tummala and E.J. Rymaszewski, eds. Microelectronics Packaging Handbook, (Van Nostrand Reinhold, 1989, NY)
46. Paul T. Vianco, "General Soldering," ASM Handbook, Vol. 6, Welding, Brazing, and Soldering (ASM International, 9639 Kinsman Road, Materials Park, Ohio 44073 USA, 1993)
47. M.E. Warwick, "The Wetting and Mechanical Properties of Lead-Free Capillary Plumbing Solders," ATB Metallurgie XXV, No. 1, 43-50 (1985)
48. Welco Castings, Solder Data Sheet, 2 Hillyard Street, Hamilton, Ontario, Canada
49. Walter L. Winterbottom, "Converting to Lead-Free Solders: An Automotive Industry Perspective," JOM, 20-24 (July 1993)
50. Tim Wong and A.H. Matsunaga, "Ceramic Ball Grid Array Solder Joint Thermal Fatigue Life Enhancement," Proceedings: NEPCON West Conference (February 28 – March 2, 1995), Anaheim, CA

   5.2. Reference Books:

1. ASM Handbook, Vol. 6, Welding, Brazing, and Soldering (ASM International, 9639 Kinsman Road, Materials Park, Ohio 44073 USA, 1993)
2. P. Borgesen, K.F. Jensen and R.A. Pollak, eds., "Electronic Packaging Materials Science VII," Matls. Res. Soc. Symp. Proc. Vol. 323, (MRS, Pittsburgh, 1994
3. E.A. Brandes, Smithells Metals Reference Book, 6^th ed. (Butterworths, London, 1983)
4. J.R. Davis, ed., Metals Handbook, Desk Edition (2^nd ed.), (ASM International, Materials Park, Ohio 44073-0002 USA, 1998)
5. D.R. Frear, W.B. Jones and K.R. Kinsman, eds., Solder Mechanics (TMS, 1991)
6. D.R. Frear, H.S. Morgan, S.N. Burchett, and J.H. Lau, eds., The Mechanics of Solder Alloy Interconnects (Van Nostrand Reinhold. New York, 1994)
7. D.E. Gray, ed., American Institute of Physics Handbook, (McGraw-Hill, New York, 1957)
8. R.J. Klein Wassink, Soldering in Electronics (Electrochemical Publications, Ltd., 1989)
9. N.A. Lange, Handbook of Chemistry, p. 100 (Handbook Publishers, Sandusky, Ohio, 1956)
10. Lieberman, Modern Soldering and Brazing Techniques (Business News Publishing Co., 1988)
11. H.H. Manko, Solders and Soldering, 3^nd ed. (McGraw-Hill, 1992)
12. R. Skipp, Soldering Handbook (McGraw-Hill, 1964)
13. R.R. Tummala and E.J. Rymaszewski, eds. Microelectronics Packaging Handbook, (Van Nostrand Reinhold, 1989, NY)
14. Paul T. Vianco, "General Soldering," ASM Handbook, Vol. 6, Welding, Brazing, and Soldering (ASM International, 9639 Kinsman Road, Materials Park, Ohio 44073 USA, 1993)
15. R.W. Woodgate, The Handbook of Machine Soldering, 2^nd ed. (John Wiley & Sons, 1988)

   5.3. Useful URLs:

     Organizations Involved in Lead-Free Solder Issues:

1. Japan Electronic Industry Development Association (JEIDA): "Challenges and Efforts Toward Commercialization of Lead-free Solder – Road Map 2000 for Commercialization of Lead-free Solder" – Ver 1.2

2. Lead Free Soldering Technology Centre (Soldertec)

( www.lead-free.org/ and http://www.solderworld.com/ )

3. IPC: Association Connecting Electronics Industries ("Get the Lead OUT!)

( http://www.leadfree.org/ )

4. Materials Properties and Data, Materials Science and Engineering Laboratory (MSEL), NIST

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