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Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0

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National Institute of Standards & Technology and
Colorado School of Mines

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Properties of Lead-Free Solders (Cont.)

Table 4.1.b. (Continuation) Designation and Composition of Lead-Free Solders.
A.C. = "Alloy Code"; L = liquidus; S = solidus; P.R. = pasty range; CTE = coefficient of thermal expansion. Blank cells indicate either zero composition or no available data.
[Due to space limitations, source is documented at end of this series of tables.]
A. C.


Composition (wt%)

Comments

Melting
Temperature
(ºC)

Density (g/cm3)

 Spec-
ific Heat (J/g)		 CTE
(µm
per m.ºC)
Sn Ag Bi Cu In Sb Zn Pb
L S P. R. Meas. Calc.
F1

90

2

7.5

 0.5         ITRI alloy, meets acceptance criteria; lower elongation

213

193

20

  

7.50

    
F2

96.1

2.6

   0.8  

0.5

     AIM "Castin" alloy. Meets acceptance criteria, good results in mfg. Trials

226

211

15

  

7.37

  

26.2
F3

95.5

0.5

  

4

         Englehart alloy. Meets acceptance criteria; high liquidus

226

218

8

  

7.37

    
F4

83.6

      

8.8

 -

7.6

   Midrange, Indium alloy. Low elongation. Zinc drossing

195

178

17

  

7.29

    
F5

77.2

      

20

  

2.8

   Indium alloy; wide pasty range

180

106

74

  

7.30

    
F6

88

  

5

      

7

   Alpha midrange alloy; Zinc drossing

194

185

9

  

7.38

  

20.5
F7

65.5

  

31.5

      

3

   Alpha alloy, wide pasty range

171

133

38

  

7.93

    
F8

95

3.5

    

1.5

       Alpha high-indium alloy; meets acceptance criteria; lower yield strength may be beneficial

220

214

6

  

7.38

  

20.4
F9

90

2

0.5

    

7.5

     Alpha quaternary alloy

238

229

9

  

7.30

    
F10

97

0.2

  

2

  

0.8

     Kester alloy, meets acceptance criteria; lower yield strength may be beneficial

230

219

11

  

7.33

  

21.8
                                 
F11

78

2.5

19.5

           Kester alloy; wide pasty range

196

138

58

  

7.74

    
F12

56

3

41

           IBM Endicott alloy; low elongation (38.9%)

166

138

28

  

8.24

    
F13

43

  

55

2

         High Cu, similar to A6; lower elongation, wider pasty range

140

138

2

  

8.53

    
F14

50

  

48

2

         Similar to F13 and A6; lower elongation (18.5%), wider pasty range

153

138

15

  

8.35

    
F15

42

  

57

  

1

       IBM alloy; high Bi content, improved elongation over A6, meets acceptance criteria; poor wetting

138

132

6

  

8.54

  

16.5
F16

42

  

56.7

0.3

1

       IBM alloy; similar to F15, lower elongation

138

132

6

  

8.54

    
F17

91.8

3.4

4.8

           SNL alloy #1. Similar to E4; small peak at 137 ºC from quench.

215.9

211

4.9

  

7.47

  

22.3
F18

82

  

3

  

15

       NIST Sn-Bi-In system, similary to EN1; 113 ºC solidus  

113

    

7.37

    
F19

82

3

5

  

10

       Midrange high-In alloy, composition adjusted to reduce pasty range        

7.46

    
F20

85

  

5

  

10

       Midrange high-In alloy, composition adjusted to reduce pasty range        

7.40

  

20.3
                                 
F21

77.2

2.8

    

20

       INDALLOY 227

187

175

12

  

7.36

  

23.1
F22

95

0.1

1

    

3.9

     Plumbing solder        

7.29

    
F23

95

0.5

1.5

    

3

     Plumbing solder        

7.32

    
F24

43

  

55

      

2

   Ternary Sn-Bi-Zn eutectic        

8.49

    
F25

43.5

0.5

56

           Ternary Sn-Bi-Ag eutectic        

8.53

    
F26

88.9

4.5

  

1.6

  

5

     SNL alloy #2        

7.39

    
F27

95.5

3.5

  

0.5

     1   AT&T alloy [check total composition, 100.5%]

221

219

2

  

7.38

    
F28

85.7

3

    

10.9

0.4

     Qualitek alloy

217.6

201

16.6

  

7.37

    
F29

93.6

4.7

  

1.7

         SNL alloy #3        

7.43

    
F30

96.1

3.2

  

0.7

         NIST alloy        

7.38

    
F31

95.2

3.5

  

1.3

         NIST alloy        

7.40

    

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Continuation of Table 4.1.

Note: Following alloys F32 to F65 and A0 were experimental or reference alloys prepared to investigate failures due to fillet-lifting observed in through-hole joints when soldered with certain lead-free solder alloys. Because these alloys were not intended to replace tin-lead solder, their property values were not systematically collected.
A. C.


Composition (wt%)

Comments

Melting
Temperature
(ºC)

Density (g/cm3)

 Spec-
ific Heat (J/g)		 CTE
(µm
per m.ºC)
Sn Ag Bi Cu In Pb
L S P. R. Meas. Calc.
F32

95.54

3.47

    

0.99

   Alloy A4, plus 1% In; Sn/Ag ratio preserved

223

218.8

4.2

  

7.38

    
F33

93.69

3.40

    

2.91

   Alloy A4, plus 3% In; Sn/Ag ratio preserved

216

214.1

1.9

  

7.38

    
F34

91.90

3.33

    

4.76

   Alloy A4, plus 5% In; Sn/Ag ratio preserved

214.7

210.4

4.3

  

7.38

    
F35

94.06

2.97

1.98

  

0.99

   Alloy E4, plus 1% In; Sn/Ag ratio preserved

221.1

215.2

5.9

  

7.40

    
F36

92.23

2.91

1.94

  

2.91

   Alloy E4, plus 3% In; Sn/Ag ratio preserved

215.1

208.9

6.2

  

7.40

    
F37

90.48

2.86

1.90

  

4.76

   Alloy E4, plus 5% In; Sn/Ag ratio preserved

210.1

202.8

7.3

  

7.40

    
F38

90.89

3.37

4.75

  

0.99

   Alloy E4, plus 1% In; Sn/Ag ratio preserved

215.9

210.4

5.5

  

7.47

    
F39

89.13

3.30

4.66

  

2.91

   Alloy E4, plus 3% In; Sn/Ag ratio preserved

212.6

206.1

6.5

  

7.46

    
F40

87.43

3.24

4.57

  

4.76

   Alloy E4, plus 5% In; Sn/Ag ratio preserved

208.0

199.1

8.9

  

7.46

    
                             
F41

89.5

3.5

7

        

202.0

185

17

  

7.51

    
F42

86.5

3.5

10

        

213.3

205.5

7.8

  

7.57

    
F43

91.5

2.5

  

1

5

   Ag reduced to increase ductility; Cu added to improve wetting. Same room-temperature strength as for F2.

205

140

    

7.37

    
F44

91.5

1.5

  

2

5

   Ag reduced to increase ductility; Cu added to improve wetting. Same room-temperature strength as for F2.

205

140

    

7.36

    
F45

91.5

0.5

  

3

5

   Ag reduced to increase ductility; Cu added to improve wetting. Same room-temperature strength as for F2.

212

      

7.35

    
F46

95

  

5

       Ag replaced by 5% Bi to lower melting point.

222

      

7.39

    
F47

94

  

5

  

1

   Ag replaced by 5% Bi to lower melting point; 1% In added to increase ductility, lower melting pt.

221

      

7.39

    
F48

92

  

5

  

3

   Ag replaced by 5% Bi to lower melting point; 3% In added to increase ductility, lower melting pt.

215

      

7.39

    
F49

90

  

5

  

5

   Ag replaced by 5% Bi to lower melting point; 3% In added to increase ductility, lower melting pt.

210

      

7.39

    
F50

95

      

5

   Sn only, with 5% In added to increase ductility, lower melting pt

221

      

7.30

    
                             
F51

93.5

0.5

  

1

5

   Reintroduce Ag; add Cu at eutectic composition; complements F43-F45.        

7.33

    
F52

92.5

1.5

  

1

5

   Add more Ag; add Cu at eutectic composition; complements F43-F45.        

7.35

    
F53

94

  

1

  

5

   Reintroduce 1% Bi to lower melting point; keep In at 5%.        

7.32

    
F54

92

  

3

  

5

   Increase Bi; keep In at 5%.        

7.36

    
F55

94.5

0.5

    

5

   Remove Bi, reintroduce Ag; keep In at 5%.        

7.31

    
F56

93.5

1.5

    

5

   Increase Ag; keep In at 5%.        

7.33

    
F57

94.15

3.41

      

2.44

 2.5% Pb added to A4; Sn/Ag ratio maintained same as in A4        

7.44

    
F58

91.90

3.33

      

4.76

 5% Pb added to A4; Sn/Ag ratio maintained same as in A4        

7.50

    
F59

89.56

3.32

4.68

    

2.44

 2.5% Pb added to F17; Sn/Ag ratio maintained same as in F17        

7.53

    
F60

87.43

3.24

4.57

    

4.76

 5% Pb added to F17; Sn/Ag ratio maintained same as in F17        

7.59

    
                             
F61

92.68

      

4.88

2.44

 2.5% Pb added to F50; Sn/In ratio maintained same as in F50        

7.37

    
F62

90.48

      

4.76

4.76

 5% Pb added to F50; Sn/In ratio maintained same as in F50        

7.43

    
F63

97.5

2.5

                  

7.36

    
F64

95.12

2.44

      

2.44

 2.5% Pb added to F63; Sn/Ag ratio maintained same as in F63        

7.42

    
F65

92.86

2.38

      

4.76

 5% Pb added to F63; Sn/Ag ratio maintained same as in F63        

7.48

    
A0

100

           Reference: pure Sn        

7.30

    

Source: Technical Reports for the Lead Free Solder Project: Alloy Descriptions: "Lead-Free Solder Alloy Designation and Composition;" Lead Free Solder Project CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998.

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