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Database for Solder Properties with Emphasis on New Lead-free Solders Release 4.0

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National Institute of Standards & Technology and
Colorado School of Mines

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Properties of Lead-Free Solders

1. Mechanical Properties: Elastic modulus, elongation, tensile strength, yield strength, wetting properties.

Table 1.1. Strength and Ductility of Low-Lead Alloys Compared with Alloy Sn-37Pb (NCMS Alloy A1), Ranked by Yield Strength (15 Alloys) and by Total Elongation (19 Alloys).
Alloy
Code		 Alloy
Composition		 Yield
Strength
(psi)		 Alloy
Code		 Alloy
Composition		 Total
Elongation
(%)
C5 Sn-2Ag-9.8Bi-9.8In 14,560 B6 Sn-56Bi-2In 116
F1 Sn-2Ag-7.5Bi-0.5Cu 12,370 F15 Sn-57Bi 77
F11 Sn-2.5Ag-19.5Bi 12,070 D2 Sn-57Bi-2In 72
D10 Sn-3Ag-54Bi-2Cu-2Sb 11,440 D5 Sn-57Bi-1Sb 60
F7 Sn-31.5Bi-3Zn 10,500 B2 Sn-52Bi 57
D9 Sn-3Ag-54Bi-2In-2Sb 5,055 B1 Sn-50Bi 53
F8 Sn-3.5Ag-1.5In 4,616 A8 Sn-75Pb 53
A1 Sn-37Pb 3,950 F7 Sn-31.5Bi-3Zn 53
F10 Sn-0.2Ag-2Cu-0.8Sb 3,758 A1 Sn-37Pb 48
F3 Sn-0.5Ag-4Cu 3,724 D4 Sn-57Bi-2Sb 47
A5 Sn-5Sb 3,720 A6 Sn-58Bi 46
A8 Sn-75Pb 3,426 D7 Sn-3Ag-55.5Bi-1.5Sb 45
F2 Sn-2.6Ag-0.8Cu-0.5Sb 3,311 D8 Sn-3Ag-55Bi-2Sb 44
A4 Sn-3.5Ag 3,256 F13 Sn-55Bi-2Cu 41
A3 Sn-97Pb 1,126 F2 Sn-2.6Ag-0.8Cu-0.5Sb 9
           
      C5 Sn-2Ag-9.8Bi-9.8In 7
      D10 Sn-3Ag-54Bi-2Cu-2Sb 4
      E9 Sn-10Bi-20In 4
      B5 Sn-2Ag-46Bi-4Cu 3

Source: Technical Reports for the Lead Free Solder Project: Properties Reports: "Room Temperature Tensile Properties of Lead-Free Solder Alloys;" Lead Free Solder Project CD-ROM, National Center for Manufacturing Sciences (NCMS),1998.

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Table 1.2. Tensile Properties of Lead-Free Solders (A.C.: Alloy Code (NCMS); Blank cells: no values reported)
 

A.C.

 Chemical Compo-sition Elastic
Modulus		 0.2%
Yield
Strength 		Tensile
Strength		 Relative
Elongation
(%)		 Strength
Coefficient		 Hard
ening

Expo
nent
Wt% ksi GPa psi MPa psi MPa Uni-
form		 Total psi MPa
A1 Sn-37Pb 2,273 15.7 3,950 27.2 4,442 30.6 3 48 4,917 33.9 0.033
A2 Sn-2Ag-36Pb 2,617 18.0 6,287 43.3 6,904 47.6 1 31 7,223 49.8 0.011
A3 Sn-97Pb 2,753 19.0 1,126 7.8 2,383 16.4 27 38 3,934 27.1 0.235
A4 Sn-3.5Ag 3,793 26.2 3,256 22.5 3,873 26.7 3 24 4,226 29.1 0.026
A5 Sn-5Sb 6,460 44.5 3,720 25.7 5,110 35.2 3 22 4,177 28.8 0.031
A6 Sn-58Bi 1,720 11.9 7,119 49.1 8,766 60.4 3 46 9,829 67,8 0.029
A7 Sn-3.5Ag-0.5Sb-1Cd     7,545 52.0       15      
A8 Sn-75Pb     3,426 23.6       53      
                         
B1 Sn-50Bi     8,263 57.0 8,965 61,8   53      
B2 Sn-52Bi     6,414 44.2 8,834 60.9   57      
B5 Sn-2Ag-46Bi-4Cu     9,806 67.6 10,070 69.4   3      
B6 Sn-56Bi-2In     7,224 49.8 8,429 58.1   116      
                         
C1 Sn-2Ag-1.5Sb-29Pb     6,489 44.7 6,865 47.3   25      
C2 Sn-3Ag-4Cu     6,276 43.3 7,006 48.3   22      
C3 Sn-2.5Ag-2Bi-1.5Sb     7,070 48.7 8,117 56.0   21      
C4 Sn-3Ag-1Bi-1Cu-1.5Sb     8,361 57.6 9,256 63.8   21      
C5 Sn-2Ag-9.8Bi-9.8In     14,560 100.4 15,380 106.0   7      
                         
D2 Sn-57Bi-2In     7,304 50.4 8,436 58.2   72      
D3 Sn-2Ag-57Bi     9,487 65.4 10,390 71.6   31      
D4 Sn-57Bi-2Sb     8,521 58.8 9,586 66.1   47      
D5 Sn-57Bi-1Sb     8,285 57.1 8,944 61.7   60      
D6 Sn-2Ag-56Bi-1.5Sb     9,063 62.5 9,946 68.6   27      
D7 Sn-3Ag-55.5Bi-1.5Sb     8,665 59.7 9,379 64.7   45      
D8 Sn-3Ag-55Bi-2Sb     8,984 61.9 9,807 67.6   44      
D9 Sn-3Ag-54Bi-2In-2Sb     5,055 34.9 11,640 80.3   13      
D10 Sn-3Ag-54Bi-2Cu-2Sb     11,440 78.9 12,280 84.7   4      
                         
E1 Sn-3Ag-2Sb     5,749 39.6 6,124 42.2   25      
E2 Sn-3Ag-2Cu-2Sb     6,684 46.1 7,655 52.8   32      
E3 Sn-3Ag-2Bi-2Sb     6,918 47.7 9,212 63.5   36      
E4 Sn-3Ag-2Bi     5,463 37.7 7,930 54.7 6 30 8,946 61.7 0.041
E5 Sn-2.5Ag-2Bi     6,592 45.5 7,564 52.2   26      
E6 Sn-2Bi-1.5Cu-3Sb     7,343 50.6 9,350 64.5   28      
E7 Sn-2Bi-8In     7,160 49.4 7,970 55.0   25      
E9 Sn-10Bi-20In     -- -- 6,938 47.8   4      
E10 Sn-9Zn     7,478 51.6 7,708 53.1   27      
                         
F1 Sn-2Ag-7.5Bi-0.5Cu     12,370 85.3 13,440 92.7   12      
F2 Sn-2.6Ag-0.8Cu-0.5Sb     3,311 22.8 3,749 25.8 2 9 4,536 31.3 0.049
F3 Sn-0.5Ag-4Cu     3,724 25.7 4,312 29.7   27      
F4 Sn-8.8In-7.6Zn     6,033 41.6 6,445 44.4   14      
F5 Sn-20In-2.8Zn     5,095 35.1 5,381 37.1   31      
F7 Sn-31.5Bi-3Zn     10,500 72.4 11,210 77.3   53      
F8 Sn-3.5Ag-1.5In     4,616 31.8 4,987 34.4   26      
F9 Sn-2Ag-0.5Bi-7.5Sb     8,230 56.7 8,773 60.5   19      
F10 Sn-0.2Ag-2Cu-0.8Sb     3,758 25.9 4,323 29.8   27      
F11 Sn-2.5Ag-19.5Bi     12,070 83.2 13,450 92.7   17      
F12 Sn-3Ag-41Bi     9,287 64.0 10,130 69.8   39      
F13 Sn-55Bi-2Cu     8,985 62.0 9,478 65.4   41      
F14 Sn-48Bi-2Cu     8,899 61.4 9,495 65.5   19      
F15 Sn-57Bi     7,972 55.0 8,540 58.9   77      
F16 Sn-56.7Bi-0.3Cu-1In     8,359 57.6 8,985 62.0   38      
F17 Sn-3.4Ag-4.8Bi     6,712 46.3 10,349 71.4 5 16 17,795 122.7 0.153

Source: Technical Reports for the Lead Free Solder Project: Properties Reports: "Room Temperature Tensile Properties of Lead-Free Solder Alloys;" Lead Free Solder Project CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998.

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Table 1.3. Elastic Properties of Sn-37Pb (eutectic) and Sn-3.5Ag
Property Sn-37Pb Sn-3.5Ag Sn-5Sb
Melting Point, ºC 183 221  
UTS* MPa 31 – 46 55  
Elongation, % 35 – 176 35  
Shear Strength, MPa 28.4 32.1  
Young’s Modulus§, GPa 35§ 56§ 58§

*Ultimate Tensile Strength
Jeff D. Sigelko and K.N. Subramanian, "Overview of lead-free solders," Adv. Mat. & Proc., pp. 47-48 (March 2000)
§ Rodney J. McCabe and Morris E. Fine, "Athermal and Thermally Activated Plastic Flow in Low Melting Temperature Solders at Small Stresses," Scripta Materialia 39(2), 189 (1998).

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Table 1.4. Elastic Properties of Sb-2.5Ag-0.8Cu-0.5Sb (Castin™) and Sn-37Pb Eutectic - A
Tensile Properties (1 ksi = 6.895 MPa)
  Castin™ Sn-37Pb
(ksi) (MPa) (ksi) (MPa)
Young’s Modulus 7420 51.16 (GPa) 4870 33.58 (GPa)
Yield Strength 4.86 33.5 4.38 30.2
UTS* 5.73 39.5 4.92 33.92
Elongation (%) 50.00 52.87
Compressive Properties
  (ksi) (MPa) (ksi) (MPa)
Elastic Modulus 4260 29.37 (GPa) 3990 27.51 (GPa)
Yield Strength 4.33 29.85 4.52 31.16
Stress (25 ° /u) 8.54 58.88 7.17 49.44
Rockwell Hardness
(15 W scale hardness)		 18.28 10.08

*Ultimate Tensile Strength
Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys," Proc. 50th IEEE 2000 Electronic Components and Technology Conference (May 21-24, 2000), Las Vegas, NV

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Table 1.5. Elastic Properties of Sb-2.5Ag-0.8Cu-0.5Sb (Castin™) and Sn-37Pb Eutectic - B
Tensile Properties (1 ksi = 6.895 MPa)
  Castin™ Sn-37Pb
(ksi) (MPa) (ksi) (MPa)
Young’s Modulus 4300 29.65 (GPa) 5740 39.58 (GPa)
Yield Strength 4.03 27.8 4.07 28.1
UTS* 5.56 38.3 5.91 40.7
Elongation (%) 50.00 43.66
Compressive Properties
  (ksi) (MPa) (ksi) (MPa)
Young’s Modulus 10890 75.08 (GPa) 16600 11.45 (GPa)
Yield Strength
(0.2% strain)		 4.53 31.2 4.84 33.4
Stress (25 ° strain) 10.07 69.4 9.88 68.1
Rockwell Hardness
(16 W scale hardness)		 13.5 12.2

*Ultimate Tensile Strength
Note: It is not stated explicitly, but accompanying textual description suggests that the measured specimens of these alloys may have been first soaked at 125 ° C before the properties listed in this table were measured. This may explain the differences in measured properties between this table and the previous one (A) comparing Castin™ with Sn-37Pb.
Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys," Proc. 50th IEEE 2000 Electronic Components and Technology Conference (May 21-24, 2000), Las Vegas, NV

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Table 1.6. Parameters for Strain Rate (Norton Equation, de/dt = A·sn·exp(-Q/RT); and Dorn Equation, de/dt = A·(sn/T)·exp(-Q/(RT))); Stress-relaxation Rate,ds/dt = A·(s-st)n ·exp(-Q/(RT)); and Strain-rate Sensitivity, s = C·(de/dt)m; for Two Lead-Free Solder Alloys, Sn-3.5Ag and Sn-9Zn.
Here e is strain, t is the time variable, de/dt is strain rate (s–1), A and C are constants, s is stress (MPa), st is a threshold stress for stress relaxation, n is the stress exponent, Q is an activation energy (kJ/mol), R is the universal gas constant, T is absolute temperature, and m is the strain-rate sensitivity.
Alloy Norton Dorn Stress Relaxation Temperature            (ºK)
Tensile Creep Tensile Creep 25 80
Sn-3.5Ag A 6.62·10-3 1.50·10-3 5.83 1.36·10-3      
  n 12 11.3 12 11.3 6    
  Q 108.5 79.5 111.2 82.3 33.5    
  m           0.080 0.083
  st         9.8    
                 
Sn-9Zn A 9.27 0.0217 8220 19.1      
  n 8.1 5.7 8.1 5.7 4.2    
  Q 99.9 65.2 102.6 68.0 106.9    
  m           0.122 0.124
  st         3    
                 
Sn-37Pb n   6.2*          
  Q   64*          

*E.W. Hare and R.G. Stang, J. Electronic Mater. 21, 599 (1992)
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine, "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," J. Electronic Materials, 26(7), 783 (1997)

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Table 1.7. Steady-state Creep Properties and Associated Mechanisms for Three Lead-free Solders and Sn-37Pb Eutectic
Alloy Deformation Mechanism

B*
(MPa-n·s-1)

DH
(eV)

n
(40 ºC)

n
(140 ºC)
Sn-4Cu-0.5Ag athermal, short-range Cu clustering 4.229×10-12 0.062 8.36 8.36
Sn-2Cu-0.8Sb-0.2Ag dislocation
glide / climb		 3.031 0.85 8.91 7.37
Sn-36Pb-2Ag dislocation
glide / climb		 0.04423 0.50 5.25 5.25
Sn-37Pb dislocation
glide / climb		 0.205 0.49 5.25 5.25

Y.-H. Pao, S. Badgley, R. Govila and E. Jih, "An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder Joints," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)
[Here the steady-state creep behavior was assumed to be described by (Norton’s Law; see previous table, "Parameters for Strain Rate"), dgcrp/dt=B*tn exp(- DH/(kT)), with dgcrp/dt as the rate of shear creep strain, t the shear stress, n a stress exponent, DH an activation energy, kT the product of Boltzmann’s constant and absolute temperature, and B* a material constant.]

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Table 1.8. Stress Exponents and Activation Energies for Dorn Equation for Tin and Four Lead-Free Solder Alloys
Alloy Region 1 Region 2 Region 3
Activation Energy, Q

(kJ/mol)

 Stress Exponent, n Activation Energy, Q

(kJ/mol)

 Stress Exponent, n Activation Energy, Q

(kJ/mol)

 Stress Exponent, n
Sn         66 8.4
Sn-2.6Sb     115 5.9 87 9.0
Sn-5Sb     103 5.7 85 11.6
Sn-7.8Sb 68 0.9 52 6.2 49 9.8
Sn-2Sb-2In     71 5.9 96 9.3

Rodney J. McCabe and Morris E. Fine, "The Creep Properties of Precipitation-Strengthened Tin-Based Alloys," JOM, p. 33 (June 2000)

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Table 1.9. Activation Energy versus Strain Rate for Two Lead-Free Eutectic Solders (Sn-3.5Ag and Sn-9Zn)

Strain Rate
(s-1)

Activation Energy
(J/mol)
Sn-3.5Ag Sn-9Zn
10–2 8.56 12.3
10–3 9.97 12.5
10–4 7.90 12.1
10–5 9.70 12.6

H. Mavoori, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer and Morris E. Fine, "Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders," Mat. Res. Soc. Symp. Proc. Vol. 390, p. 161 (MRS, 1995)

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Table 1.10. Elastic Properties of Metallic Elements Used In Electronic Packaging
Metal Condition E
(Elastic)
(GPa)		 G
(Shear)
(GPa)		 Tensile Strength
(MPa)		 Yield Strength*
(MPa)
Aluminum 99.996 Annealed 68.9 26.5 47.4 12.2
Antimony   77.8   11  
Copper 99.997 Rod, cold-drawn 127.7 46.8 351 340
Gold 99.99 Cast 74.4   124  
Lead 99.90 Rolled, aged       9.5 (0.5 %)
Molybdenum Pressed, sintered sheet 340   690  
Nickel >99.0 Wrought, annealed 210   482 138
Platinum 99.99 Annealed 147   120-130  
Silver Strained 5 %, heated 5 hr at 350 C 71 – 78      
Tin Pure, cast 41 – 45   21.4  
Tin-5Ag Sheet, aged at room temp.     31.7 24.8
Tungsten   340 135    
Zinc <0.10 Pb Hot-rolled strip     134-160  

*(0.2 % offset)
D.E. Gray, ed., American Institute of Physics Handbook, pp. 2-61 ff. (McGraw-Hill, New York, 1957) [Note: original units were in dyn/cm2; 10 dyn/cm2 = 1 N/m2 = 1 Pa]

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[THE FOLLOWING TABLE STILL NEEDS A COMPLETE DOCUMENTATION OF SOURCE]:

Table 1.11. Material Properties of a Via-in-Pad Chip-Scale Package Printed Circuit Board Assembly
Property
Material 		Young’s Modulus
(GPa)		 Poisson’s Ratio
(nu)		 Thermal Expansion Coefficient (alpha)
(10-6/K)
FR-4 epoxy-glass PCB substrate 22 0.28 18.5
Copper VIP
(via-in-pad)		 76 0.35 17
Sn-37Pb
(eutectic) solder		 E=32.0-0.088·t (0 <= t <= 100, t is Celsius temp.) 0.4 21
Underfill 6 0.35 30
Silicon chip 131 0.3 2.8
Solder mask 6.9 0.35 19
*Al 69 0.33 22.8
*Si3Ni4 314 0.33 3
Micro-via filler 7 0.3 35
Bismaleimide
Triazene (BT)		 26 0.39 15

J. Lau, C. Chang, R. Lee, T.-Y. Chen, D. Cheng, T.J. Tseng, D. Lin, "Thermal-Fatigue Life of Solder Bumped Flip Chip on Micro Via-In-Pad (VIP) Low Cost Substrates"

*J.H. Lau and S.-W. Ricky Lee, "Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies with Imperfect Underfills," Proceedings: NEPCON West Conference (February 28 – March 2, 1995), Anaheim, CA

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Table 1.12. Elastic Properties and Thermal Expansion Coefficient of Electronic  - Packaging Materials and Lead Solder Alloys
Material Temp.
(ºC)		 Young’s
Modulus,
(GPa)		 Poisson’sbr>Ratio (n ) Thermal Exp.
Coefficient (10-6/K)
Sn-37Pb
(eutectic) solder		 -70
20
140		 38.1
30.2
19.7		 0.4
0.4
0.4		 24.0
24.0
24.0
Pb-10Sn -55
22
100		 13.4
9.78
4.91		 0.4
0.4
0.4		 27.8
28.9
30.5
Alumina
(substrate)		 -55
22
100		 303
303
303		 0.21
0.21
0.21		 3.9
4.5
6.7
Silicon chip -73
27
127		 162
162
162		 0.22
0.22
0.22		 1.40
2.62
3.23
Polyimide PWB -55 to
125		 14.5 0.16 13.0
Hysol
FP4526
Underfill		 -73
25
52
77
102
127		 9.78
9.51
9.23
8.82
7.72
5.37		 0.3
0.3
0.3
0.3
0.3
0.3		 33.0
33.0
33.0
33.0
33.0
33.0

Tim Wong and A.H. Matsunaga, "Ceramic Ball Grid Array Solder Joint Thermal Fatigue Life Enhancement," Proceedings: NEPCON West Conference (February 28 – March 2, 1995), Anaheim, CA

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Table 1.13. Lead-free Solder Alloys: Tensile and Shear Strengths
Lead-free
Solder Alloy

Temperature
(ºF)

 Tensile Strength
(psi)		 Shear Strength
(psi)		 Density
(g/cm3)
Solidus Liquidus
Sn (pure) 450 450 1800 2560 7.31
           
Sn-3.5Ag 430 430 8900 4600 7.36
Sn-5Ag 430 473 10100 8400 7.45
Sn-3Cu 441 635 6420 NA 7.34
Sn-5Sb 450 464 5900 6200 7.26

                       Solder Data Sheet, Welco Castings, 2 Hillyard Street, Hamilton, Ontario, Canada

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Table 1.14. Lead-containing Solder Alloys: Tensile and Shear Strengths
Solder (Lead) Alloy

Temperature
(ºF)

 Tensile Strength
(psi)		 Shear Strength
(psi)		 Density
(g/cm3)
Solidus Liquidus
Pb (pure) 621 621 1780 1800 11.34
Pb-1Sn-1.5Ag     3600    
Pb-5Sn 518 596 4190 3000 11.13
Pb-10Sn 514 576 4400 3780 10.94
Pb-15Sn 437 553 4700 4470 10.7
Pb-20Sn 362 533   4740 10.5
Pb-25Sn 362 514 5770 5310 10.3
Pb-30Sn 362 490 6140 5500 9.8
Pb-35Sn 362 475 6230 5590 9.6
Pb-38Sn 362 465 6285 5640 9.81
Pb-40Sn 362 460 6320 5680 9.34
Pb-45Sn 362 440 6400 5780 9.13
Pb-50Sn 362 420 6450 5870 8.91
Pb-60Sn 362 375 6400 5700 8.67
Pb-62Sn 362 363 6700 6060 8.50
Pb-63Sn
(eutectic)		 362 362 6700 6060 8.42
Pb-95Sn     5900    
Sn-36Pb-4Ag 350 378 8500 7000 8.88

                       Solder Data Sheet, Welco Castings, 2 Hillyard Street, Hamilton, Ontario, Canada

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Table 1.15. Shear Strengths of Three Lead-Free Solders and Tin-Lead Eutectic (by Ring-and-Plug Test)
Solder Load Stress (area = 0.046 in2)
(lbs) (N) (psi) (MPa)
Sn-37Pb (eutectic) 269 + 11 1197 + 49 5840 + 240 40.27 + 1.65
Sn-3.5Ag 367 + 24 1632 + 107 7970 + 530 54.95 + 3.65
Sn-3.33Ag-4.83Bi 540 + 80 2402 + 356 11,800 + 1700 81.36 + 11.7
Sn-3.15Ag-5.0Bi-5.0Au 560 + 15 2491 + 67 12,170 + 330 83.91 + 2.28

Cynthia L. Hernandez, Paul T. Vianco, Jerome A. Rejent, "Effect of Interface Microstructure on the Mechanical Properties of Pb-Free Hybrid Microcircuit Solder Joints," IPC/SMTA Electronics Assembly Expo (1998), p. S19-2-1

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Table 1.16. Mechanical Properties of Tin, Tin-Lead, and Four Lead-Free Solder Alloys (by Ring-and-Plug Tests)
 

Alloy

 Shear Strength

at 1mm/min

(MPa)

 Stress to Rupture

in 1000 hr

(MPa)

 Fatigue Strength

in 1000 cycles

(MPa)
Temperature Temperature Temperature
Room 100 ºC Room 100 ºC Room 100 ºC
Sn (pure) 22.6 19.3 8.4 2.2 13.7 9.0
Sn-1Cu 28.5 21.2 7.8 2.2 14.9 8.3
Sn-3.5Ag 39.0 23.5 14.0 5.5 18.6 10.5
Sn-5Sb 38.7 21.3 11.0 3.6 20.9 14.1
Sn-58Bi 48.0 15.6 3.3 0.9 16.0 7.9
             
Sn-40Pb 34.5 21.6 3.5 1.1 16.2 10.2

International Tin Research Institute, Publ. No. 656; through: William B. Hampshire, "The Search for Lead-Free Solders," Proc. Surface Mount International Conference (Sept. 1992) San Jose, CA, p. 729

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Table 1.17. Shear Strengths, Solidus and Liquidus Temperatures, and Wetting Angles of Experimental Sn-Ag-Cu Solder Alloys
Alloy
Shear Strength (MPa)
(Cross-head speed: 0.1 mm/min;
gap thickness: 76.2 µm)
 Tsol/Tliq

(ºC)

 Wetting

Angle

(deg)
Test temperature
22 ºC
170 ºC
A* B* C* # D B*
Sn-3.5Ag 20.9 61.2   27

32

 20.5 221 33
Sn-0.7Cu -- 29.8   23 10.1 227  
               
Sn-3.60Ag-1.00Cu

(gap thickness: 152.4 µm)

 54.0 67.0

+2.4

 70.8 + 2.3

(59.4 + 4.4)

   24.4 217/217.9  
Sn-3.59Ag-0.99Cu-0.15Co 65.4 65.5     22.8 217/218.5  
Sn-3.59Ag-0.99Cu-0.30Co 53.5 56.1     17.5 217/219.3  
Sn-3.58Ag-0.99Cu-0.45Co 56.7 65.7

+3.8

 56.2 + 6.2   21.2 217/218.9  
Sn-4.70Ag-1.70Cu 47.0 58.0     21.6 217 21
Sn-4.68Ag-1.69Cu-0.30Co 54.5 57.8     22.9 217/218.1 18
Sn-4.68Ag-1.69Cu-0.30Ni 50.2 65.5     23.2 217/218.1 24
Sn-3.8Ag-0.7Cu -- 63.8   27 25.1 217  
Sn-3.8Ag-0.7Cu-0.5Sb -- 64.1     28.9   44
               
Sn-40Pb 37.4 36.5   26 4.5 183/188 17

*A: Cooling rate in soldering (test) butt joints=1.5 º/s
*B: Cooling rate=10 º/s
*C: "Refined" test, (solderability and microstructure)
Measurements A, B and C by Asymmetric Four-Point Bend [AFPB] method
# D: Values from technical literature (two different sources); by ring-and-plug method

# Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C. Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Electronic Assemblies," IPCWorks ’99: An International Summit on Lead-Free Electronics Assemblies," (October 25-28, 1999), Minneapolis, MN

# Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C. Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Joining Applications," p. 575 …

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Table 1.18. Physical and Mechanical Properties of Lead-free Alloys and Sn-37Pb (eutectic)
Property Sn-3.5Ag Sn-3.5Ag-0.7Cu Sn-3.8Ag-0.7Cu@ Sn-0.7Cu
("Alloy 99C"*)		 Sn-37Pb (eutectic)
Density, g/cm3 7.5   7.5 7.3 8.4
Melting Point (ºC) 221   217 227-240* 183
Electrical Conductivity, %IACS# 14 13* 13 13* 11.9
Electrical Resistivity, µO·cm 12.3   13   14.5
Brinell Hardness, HB 15   15   17
Tensile Strength (20 ºC),
N/mm2 at Strain Rate: 0.004 s–1 		58 48* 48   40
Stress to Rupture +/- 5
N/mm2		       4300*  
+/- 10
N/mm2		       1460*  
Joint Shear Strength,
N/mm2 at 0.1 mm/min		 20 ºC 27   27 23
20*		 23
100 ºC 17   17 16
21*		 14
Creep Strength,

N/mm2 at 0.1 mm/min

 20 ºC 13.7 13* 13.0 8.6 3.3
100 ºC 5.0 5* 5.0 2.1 1.0

@Proprietary (patented) alloy ("Ecosol TSC") of Multicore Solders
*Peter Biocca, "Global Update on Lead-free Solders," Proc. Surface Mount International (San Jose, CA, 1998), pp. 705-709
#100 %IACS = 58.00 MS/m

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Table 1.19. Pure Copper, Tin and Nickel, and Their Intermetallics: Room-Temperature Physical and Thermal Properties
Property Cu Sn Ni Cu6Sn5 Cu3Sn Ni3Sn4
Density (g/cm3) 8.9 7.3 8.9 8.28 8.9 8.65
Young’s Modulus (GPa) 117 41 213 85.56 108.3 133.3
Shear Modulus (GPa)       50.21 42.41 45.0
             
Toughness (MPa·m-1/2)       1.4 1.7 1.2
Vickers Hardness (kg/mm2) 30 100 15 378 343 365
             
Electrical Resistivity (µO·cm) 1.7 11.5 7.8 17.5 8.93 28.5
             
Thermal Conductivity (W/(m·K)) 3.98 0.67 0.905 34.1 70.4 19.6
Thermal Diffusivity (cm2/s)       0.145 0.24 0.083
Specific Heat (J/(kg·K)) 0.385 0.227 0.439 286 326 272
Thermal Expansion (10–6/K) 17.1 23 12.9 16.3 19.0 13.7

D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, eds., The Mechanics of Solder Alloy Interconnects, p. 60 (Van Nostrand Reinhold, New York, 1994)

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Table 1.20. Effects of Transition Metals on Vickers Hardness and UTS of Sn-4.7Ag-1.7Cu Solder Alloys
Alloy Designation As Drawn Annealed
VHN Std. Dev. UTS

(MPa)

 Ratio, VHN:UTS VHN Std. Dev. Est.

UTS

(MPa)
Sn-3.5Ag eutectic 13.25 0.35 52 0.255 13.90 0.46 54.6
Sn-4.7Ag-1.7Cu eutectic 10.25 0.35 44 0.233 12.45 0.14 53
Sn-4.69Ag-1.69Cu-0.3Fe eutectic+Fe 6.25 0.07     15.05 0.35  
Sn-4.68Ag-1.69Cu-0.5Co Eutectic+Co 17.95 0.21 76 0.236 15.20 0.14 64
Sn-4.69Ag-1.69Cu-0.3Ni eutectic+Ni 16.55 0.35 70 0.236 13.75 0.35 58
Sn-3.59Ag-1.00Cu-0.3Ni lean eutectic+Ni 15.70 0.42 61.5 0.255 13.55 0.49 53

VHN: Vickers Hardness Number
UTS: Ultimate Tensile Strength

Iver E. Anderson, Özer Ünal, Tamara E. Bloomer and James C. Foley, "Effects of Transition Metal Alloying on Microstructural Stability and Mechanical Properties of Tin-Silver-Copper Solder Alloys," Proc. Third Pacific Rim International Conference on Advanced Materials and Processing (PRICM 3) (The Minerals, Metals and Materials Society, 1998)

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Table 1.21.1. SnAgCu Dynamic Elastic Constant.

Test Temperature
(°C)

As-cast #1 Young's Modulus (GPa)

As-cast #2 Young's Modulus (GPa)

Aged #1 Young's Modulus (GPa)

-50

57.3

56.46

56.43

-25

55.79

54.66

54.65

0

54.22

52.79

52.79

25

52.62

50.86

50.86

50

50.97

48.87

48.88

75

49.29

46.83

46.84

100

47.57

44.73

44.75

125

45.83

42.59

42.61

150

44.05

40.42

40.44

175

42.26

38.21

38.23

200

40.44

35.98

36

Source: Vianco P. T. , Sandia National Laboratories, 2001

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Table 1.21.2. SnAgCu Dynamic Elastic Constant (cont.)

Material

Parameter
Quadratic Function Coefficients
(a + bT + cT2)

a

b

c

As-cast #1

Young’s Modulus

54.21

-6.358 x 10-2

-2.685 x 10-5

 

Shear Modulus

20.24

-2.635 x 10-2

-6.503 x 10-5

 

Bulk Modulus

56.19

-5.461 x 10-3

-4.223 x 10-5

 

Poisson’s ratio

0.3392

-1.722 x 10-4

 4.879 x 109

 

 

 

 

 

As-cast #2

Young’s Modulus

52.77

-7.637 x 102

-3.885 x 105

 

Shear Modulus

19.59

-3.110 x 102

-1.077 x 105

 

Bulk Modulus

57.39

-1.258 x 102

-2.703 x 105

 

Poisson’s ratio

0.3467

 1.874 x 104

 1.096 x 107

 

 

 

 

 

Aged #1

Young’s Modulus

52.76

-7.606 x 102

-3.961 x 105

 

Shear Modulus

19.59

-3.110 x 102

-1.075 x 105

 

Bulk Modulus

57.31

-9.213 x 103

-2.810 x 105

 

Poisson’s ratio

0.3465

 1.957 x 104

 9.912 x 108

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.22.1. SnAgCu Elastic Properties vs. Temperature
Test Temperature
(°C)
Mean Yield Stress
As-Cast
(MPa)
Min. Yield Stress
As-cast
(MPa)
Max. Yield Stress
As-cast
(MPa)

-25

41.645

41.51

41.78

25

31.835

30.13

33.54

75

20.975

16.45

25.5

125

13.635

13.47

13.8

160

10.19

9.63

10.75

Source: Vianco P. T., Sandia National Laboratories, 2001.

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Table 1.22.2. SnAgCu Elastic Properties vs. Temperature (cont.)
Test Temperature
(°C)
Mean Elastic Modulus
As-Cast
(MPa)
Min.Elastic Modulus
As-cast
(MPa)
Max. Elastic Modulus
As-cast
(MPa)

-25

3978.3

2863.6

5093

25

5357.75

4956.5

5759

75

4455.5

4021.6

4889.4

125

3837.25

2836.8

4837.7

160

3309.05

2217.3

4400.8

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.22.3. SnAgCu Elastic Properties vs. Temperature (cont.)
Test Temperature
(°C)
Mean Yield Strain
As-Cast
Min. Yield Strain
As-cast
Max. Yield Strain
As-cast

-25

0.01505

0.011

0.0191

25

0.00845

0.008

0.0089

75

0.0062

0.0053

0.0071

125

0.00565

0.0045

0.0068

160

0.0056

0.0047

0.0065

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.22.4. SnAgCu Elastic Properties vs. Temperature (cont.)
Test Temperature
(°C)
Mean Yield Stress
Aged
(MPa)
Min. Yield Stress
Aged
(MPa)
Max. Yield Stress
Aged
(MPa)

-25

38.655

36.77

40.54

25

21.925

21.21

22.64

75

17.005

16.97

17.04

125

12.15

10.71

13.59

160

11.35

10.79

11.91

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.22.5. SnAgCu Elastic Properties vs. Temperature (cont.)
Test Temperature
(°C)
Mean Elastic Modulus
Aged
(MPa)
Min. Elastic Modulus
Aged
(MPa)
Max. Elastic Modulus
Aged
(MPa)

-25

3495.95

3415.9

3576

25

4312.55

3828.7

4796.4

75

4004.8

3752.6

4257

125

3336.3

2742.4

3930.2

160

3663.7

2715.7

4611.7

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.22.6. SnAgCu Elastic Properties vs. Temperature (cont.)
Test Temperature
(°C)
Mean Yield Strain
Aged
Min. Yield Strain
Aged
Max. Yield Strain
Aged

-25

0.0178

0.0165

0.0191

25

0.00715

0.0067

0.0076

75

0.00615

0.0058

0.0065

125

0.00555

0.0054

0.0057

160

0.0055

0.0049

0.0061

Source:Vianco P. T., Sandia National Laboratories, 2001

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Table 1.23.SnAgCu - Coefficient of Thermal Expansion Data. Sample: As-cast #1.
Parameter
-50°C to
-25°C
-25°C to
0°C
0°C to
25°C
25°C to
50°C
50°C to
75°C
75°C to
100°C
100°C to
125°C
125°C to
150°C
150°C to
175°C
175°C to
200°C

DL/DT

9.25E-06

1.42E-05

1.55E-05

1.57E-05

1.59E-05

1.62E-05

1.68E-05

1.69E-05

1.73E-05

1.71E-05

CTE = DL/Lo x DT

1.27E-05

1.94E-05

2.12E-05

2.15E-05

2.17E-05

2.22E-05

2.30E-05

2.31E-05

2.37E-05

2.35E-05

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.24. SnAgCu - Coefficient of Thermal Expansion Data. Sample: As-cast #2.
Parameter
-50°C to
-25°C
-25°C to
0°C
0°C to
25°C
25°C to
50°C
50°C to
75°C
75°C to
100°C
100°C to
125°C
125°C to
150°C
150°C to
175°C
175°C to
200°C

DL/DT

1.00E-05

1.43E-05

1.58E-05

1.64E-05

1.71E-05

1.70E-05

1.71E-05

1.69E-05

1.74E-05

1.59E-05

CTE = DL/Lo x DT

1.37E-05

1.95E-05

2.16E-05

2.24E-05

2.33E-05

2.32E-05

2.34E-05

2.30E-05

2.37E-05

2.17E-05

Source: Vianco P. T., Sandia National Laboratories, 2001

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Table 1.25. SnAgCu - Coefficient of Thermal Expansion Data. Sample: Aged #1.
Parameter
-50°C to
-25°C
-25°C to
0°C
0°C to
25°C
25°C to
50°C
50°C to
75°C
75°C to
100°C
100°C to
125°C
125°C to
150°C
150°C to
175°C
175°C to
200°C

DL/DT

1.01E-05

1.36E-05

1.53E-05

1.57E-05

1.61E-05

1.62E-05

1.63E-05

1.68E-05

1.72E-05

1.70E-05

CTE = DL/Lo x DT

1.42E-05

1.92E-05

2.16E-05

2.22E-05

2.28E-05

2.30E-05

2.30E-05

2.38E-05

2.44E-05

2.41E-05

Source:Vianco P. T., Sandia National Laboratories, 2001

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Table 1.26. SnAgCu - Coefficient of Thermal Expansion Data. Sample: Aged #2.
Parameter
-50°C to
-25°C
-25°C to
0°C
0°C to
25°C
25°C to
50°C
50°C to
75°C
75°C to
100°C
100°C to
125°C
125°C to
150°C
150°C to
175°C
175°C to
200°C

DL/DT

1.07E-05

1.45E-05

1.58E-05

1.62E-05

1.66E-05

1.72E-05

1.71E-05

1.70E-05

1.71E-05

1.61E-05

CTE = DL/Lo x DT

1.46E-05

1.98E-05

2.16E-05

2.20E-05

2.26E-05

2.35E-05

2.33E-05

2.32E-05

2.32E-05

2.20E-05

Source:Vianco P. T., Sandia National Laboratories, 2001

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Table 1.27. Mechanical Properties of Three Selected Pb-free Alloys: Sn-3.2Ag-0.8Cu, Sn-3.5Ag, and Sn-0.7Cu

Sample

Process*
YS
(MPa)
UTS
(MPa)

Uniform Elongation (%)

Total Elongation (%)

Sn-3.2Ag-0.8Cu

Q

26

31

4.2

24.5

Sn-3.2Ag-0.8Cu

Q

32

34

1.9

21.6

Sn-3.2Ag-0.8Cu

Q

25

30

4.0

20.2

Average

Q

28

32

3.4

22.1

Sn-3.2Ag-0.8Cu

AC

20

30

6.2

26.1

 

 

 

 

 

 

Sn-3.5Ag

Q

30

31

2.9

26.3

Sn-3.5Ag

Q

20

25

4.3

20.1

Sn-3.5Ag

Q

23

28

5.0

16.2

Average

Q

24

28

4.1

20.9

Sn-3.5Ag

AC

19

28

6.4

15.9

 

 

 

 

 

 

Sn-0.7Cu

Q

15

20

5.7

27.7

Sn-0.7Cu

Q

15

20

8.5

22.2

Sn-0.7Cu

Q

16

18

2.0

12.6

Average

Q

15

19

5.4

20.8

Sn-0.7Cu

AC

16

22

9.1

41.2

63Sn-37Pb#

-

27.2

30.6

3

48

* Q: water quenched, AC: air cooled

Source: J. Madeni, S. Liu, and T. Siewert, "Casting of Lead-Free Solder Specimens with Various Solidification Rates", ASM- International Conference, Indianapolis 2001.

# Data for the eutectic 63Sn-37Pb extracted from Table 1.2.for comparison.

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Creep data at 75<sup>o</sup>C for Sn-Ag-Cu, Sn-Ag-Bi, Sn-Ag, Sn-Bi, and Sn-Pb solder alloys
Figure 1.1. Creep data at 75oC for Sn-Ag-Cu, Sn-Ag-Bi, Sn-Ag, Sn-Bi, and Sn-Pb solder alloys

Source: Alan Woosley, Geoff Swan, T.S.Chong, Linda Matsushita, Thomas Koschmieder and Kennon Simmons, "Development of Lead (Pb) and Halogen Free Peripheral Leaded and PBGA Components to Meet MSL3 260C Peak Reflow", Work presented by the research team from Motorola at EGG, 2001

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