Workshop on Reliability Issues in Nanomaterials

 

17-19 August, 2004

Boulder, Colorado

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Plenary Presentations:

Role of Atomic-Force Microscopy in the Characterization of High-Performance and Reliable Nanomaterials, Nancy Burnham, Worcester Polytechnic Institute

NSF Programs, with Emphasis on Nano Mechanics and Materials, Ken Chong, National Science Foundation

Reliability Issues - Significance of Mechanical Behavior in Small Volumes to Design of Reliability Nanomaterials and Nanoscale Devices, William Gerberich, University of Minnesota

Nanomechanical Measurement Facility in the Advanced Measurement Laboratory, Stephen Hsu, NIST

Significance of Adhesion and Interfacial Fracture in Design of Reliable Nanomaterials and Nanodevices, Neville Moody, Sandia National Laboratories

Materials Requirements and Measurements in Nanoscale Manufacturing and Assembly, John Randall, Zyvex

300 mm XRD Metrology - Ensuring Thin Film Reliability in Microelectronics, Ken Rodbell, IBM

Nanomechanics Research at NIST, Douglas Smith, NIST

 

Challenges, Barriers, and Priorities for Nanomaterials Metrology (workshop summary #1), Bob Keller, NIST

Barriers: Standards, Fabrication Tools, Measurement Tools, Data, Understanding, Modeling Tools (workshop summary #2), Dave Read, NIST

Click for a larger version of this image. NIST Boulder Labs