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Breakout Presentations:
Measurement Challenges in Micro-tensile and Micro-fatigue Reliability
Studies, Brad Boyce, Sandia National Laboratories
Simulations of Nanotribology of
Self-Assembled Monolayers, Michael Chandross, Sandia National
Laboratories
Metrologies for in-situ
Property Measurement and Reliability Assessment in MEMS, Maarten de
Boer, Sandia National Laboratories
Mechanical and Gas Transport
Behavior of Dense Polymer Films, Alan Greenberg, University of
Colorado
CMOS to beyond CMOS, Novel Material
Characterization Challenges, Susan Holl, Intel
Adhesion Measurements of Thin Film
Structures, Mengzhi Pang, Cornell University
Biomolecule Unfolding and Mechanics
of Nacre, Jerry Qi, University of Colorado
Toughness Measurement
of Thin Films: What Does It Tell Us and How Reliable is That?, Ivar
Reimanis, Colorado School of Mines
Nano-metrology for Optoelectronics,
Alexana Roshko, NIST
Nanotechnology in Trieste,
Orfeo Sbaizero, Universita' di Trieste
Off-Chip Interconnects:
Design, Fabrication, and Reliability, Suresh Sitaraman, Georgia
Institute of Technology
Necessity of having a standard
of small force: AFM Study of Nano-mechanical Properties of Human Cells
and Other Soft Nanostructured Materials, Igor Sokolov, Clarkson
University
Need for "Single Crystal" Data from
Microconstituents of "Fully-Processed" Alloys, Michael Uchic, Air
Force Research Laboratory
Thin Film Mechanical
Reliability: Environmental Effects, Alex Volinsky, University of
South Florida
Energy Release Rate of
Quantum Islands in Stranski-Krastanov Growth, Bo Yang, Florida
Institute of Technology
Novel Experiments to Assess the
Mechanical Properties of Thin Films and Nanomaterials, Yong Zhu,
Northwestern University
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