Selected Publications - Bob Keller

 

Articles may be downloaded for personal use only. Any other use requires permission of the author and publisher.

Articles authored by NIST staff members are not subject to copyright in the U.S.

 

Keller, R. R. and D. T. Read, "The NIST Workshop on Reliability Issues in Nanomaterials, August 17 - 19, 2004," Proc. Government Microcircuit Applications and Critical Technology Conference 2005, Las Vegas, NV, April 4 - 7, 2005. (see poster also).

Keller, R. R., R. H. Geiss, Y. -W. Cheng, and D. T. Read, "Electric Current Induced Thermomechanical Fatigue Testing of Interconnects," AIP Conference Proc. 788, 2005 International Conference on Characterization and Metrology for ULSI Technology, (2005), pp. 491-495. (see poster also).

Mönig, R., R. R. Keller, and C. A. Volkert, "Thermal fatigue testing of thin metal films," Review of Scientific Instruments, 75, 4997-5004 (2004).

Keller, R. R., A. Roshko, R. H. Geiss, K. A. Bertness, and T. P. Quinn. “EBSD measurement of strains in GaAs due to oxidation of buried AlGaAs layers.” Microelectronic Engineering 75, 96-102 (2004).

Keller, R.R., Mönig, R., Volkert, C.A., Arzt, E., Schwaiger, R., and Kraft, O., “Interconnect Failure due to Cyclic Loading,” Stress-Induced Phenomena in Metallizations: 6th Int’l. Workshop, S.P. Baker, M.A. Korhonen, E. Arzt, and P.S. Ho, eds., AIP Conf. Proceedings 612, AIP, Melville, NY 119-132 (2002).

"Materials Reliability in Microelectronics VII", J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez, Jr., and Z. Suo, eds., Materials Research Society Symposium Proceedings vol. 473, 457 pages, (1997).

R.R. Keller, J.A. Nucci, and D.P. Field, “Local Textures and Grain Boundaries in Voided Copper Interconnects,” Journal of Electronic Materials 26, 996-1001 (1997).

R.R. Keller, J.M. Phelps, and D.T. Read, "Tensile and Fracture Behavior of Free-Standing Copper Films," Materials Science and Engineering A, A214, 42-52 (1996).

R.R. Keller and J.M. Phelps, "SEM Observations of Misfit Dislocations in Epitaxial In0.25Ga0.75As on GaAs(001)," Journal of Materials Research 11, 552-554 (1996).

R.R. Keller, H.J. Maier, H. Renner and H. Mughrabi, "Local Internal Stress Characterization in a Tensile-Deformed Copper Single Crystal by Convergent-Beam Electron Diffraction," Philosophical Magazine A 70, 329-340 (1994).

R.R. Keller, H.J. Maier and H. Mughrabi, "Characterization of Dislocation Networks in a Creep-Deformed Nickel-Base Superalloy," Scripta metallurgica 28, 23-28 (1993).

R.R. Keller, W. Zielinski and W.W. Gerberich, "Fatigue-Induced Near-Surface vs. Bulk Dislocation Behavior in Iron Alloys," Viewpoint Set "Surface Effects in Fatigue," Scripta metallurgica et materialia 26, 1523-1528 (1992).

 

 

 

 

Back to Materials Reliability Division

 

Back to NIST-Boulder

 

The National Institute of Standards and Technology
is an agency of the U.S. Department of Commerce's
Technology Administration

Privacy Statement/Security Notice
Disclaimer | FOIA

 

Last modified on July 07, 2006