Selected Publications
Articles may be downloaded for personal use only. Any other use requires permission of the author and publisher.
Articles authored by NIST staff members are not subject to copyright in the U.S.
Keller, R. R. and D. T. Read, "The NIST Workshop on Reliability Issues in Nanomaterials, August 17 - 19, 2004," Proc. Government Microcircuit Applications and Critical Technology Conference 2005, Las Vegas, NV, April 4 - 7, 2005. (see poster also).
Keller, R. R., R. H. Geiss, Y. -W. Cheng, and D. T. Read, "Electric Current Induced Thermomechanical Fatigue Testing of Interconnects," AIP Conference Proc. 788, 2005 International Conference on Characterization and Metrology for ULSI Technology, (2005), pp. 491-495. (see poster also).
"Materials Reliability in Microelectronics VII", J.J. Clement, R.R. Keller, K.S. Krisch, J.E. Sanchez, Jr., and Z. Suo, eds., Materials Research Society Symposium Proceedings vol. 473, 457 pages, (1997).
R.R. Keller, J.M. Phelps, and D.T. Read, "Tensile and Fracture Behavior of Free-Standing Copper Films," Materials Science and Engineering A, A214, 42-52 (1996).
R.R. Keller, H.J. Maier, H. Renner and H. Mughrabi, "Local Internal Stress Characterization in a Tensile-Deformed Copper Single Crystal by Convergent-Beam Electron Diffraction," Philosophical Magazine A 70, 329-340 (1994).
R.R. Keller, H.J. Maier and H. Mughrabi, "Characterization of Dislocation Networks in a Creep-Deformed Nickel-Base Superalloy," Scripta metallurgica 28, 23-28 (1993).
R.R. Keller, W. Zielinski and W.W. Gerberich, "Fatigue-Induced Near-Surface vs. Bulk Dislocation Behavior in Iron Alloys," Viewpoint Set "Surface Effects in Fatigue," Scripta metallurgica et materialia 26, 1523-1528 (1992).
Back to Materials Reliability Division
The National Institute of
Standards and Technology
is an agency of the U.S. Department of
Commerce's
Technology Administration
Privacy Statement/Security Notice
Disclaimer |
FOIA
Last modified on July 07, 2006