The continued growth of the U.S. optoelectronics industry is dependent on the high-yield manufacture of devices with smaller dimensions and tighter specifications. Compound semiconductor materials form the basis for LEDs, lasers, photodetectors, and modulators critical to optical communication, display, data storage, sensors, and many other applications. Many of these semiconductor devices now incorporate structures with a high degree of strain and nanostructures so small that the properties of the devices depend on their physical dimensions as well as the bulk materials properties. Measurements of starting materials, epitaxial layers, and nanostructured geometries must be supported by standard procedures and reference materials.  Issues of materials purity and uniformity are at the foundation of device yield and performance. In addition, specialty devices are needed for use in metrology systems inside and outside of this project.